AMD Phenom II Triple-Core Mobile N830 - HMN830DCR32GM笔记本cpu

类型	CPU / Microprocessor
细分市场	Mobile
系列	AMD Phenom II Triple-Core Mobile
型号	N830
CPU 编号	HMN830DCR32GM is an OEM/tray microprocessor
CPU步进	AADHC AD NADHC AD
频率	2100 MHz
总线速度	One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
时钟倍频器	10.5
封装	638-pin lidless organic micro Pin Grid Array (UOL638)
AMD 封装 number	30605
接口	接口 S1 (S1g4)
尺寸	1.38" x 1.38" / 3.5cm x 3.5cm
Weight	0.2oz / 5.7g (measured) 0.2oz / 6.5g (by specifications)
发布时间	May 12, 2010
End-of-Life date	Last order date is 3rd quarter 2011 Last shipment date is 1st quarter 2012
架构 / 微体系结构
微体系结构	K10
Platform	Danube
处理器内核	Champlain
Core stepping	BL-C3
CPUID	100F53
制造工艺	0.045 micron silicon-on-insulator (SOI) technology
数据位宽	64 bit
The number of cores	3
线程数	3
浮点单元	Integrated, 128-bit wide
1级缓存大小	3 x 64 KB 2-way set associative instruction caches 3 x 64 KB 2-way set associative data caches
2级缓存大小	3 x 512 KB 16-way set associative caches
Level 3 cache size	None
缓存延迟 ^[1]	3 (L1 cache) 15 (L2 cache)
多重处理	Uniprocessor
特征	MMX instructions Extensions to MMX 3DNow! technology Extensions to 3DNow! SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSE4a AMD64 / AMD 64-bit technology EVP / Enhanced Virus Protection AMD-V / AMD Virtualization technology
低功耗特性	PowerNow!
集成外设/组件
集成显卡	None
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1333, DDR3L-1066 Maximum memory bandwidth (GB/s): 21.3
Other peripherals	HyperTransport technology 3.0
电/热参数
热设计功耗	35 Watt
Notes on AMD Phenom II N830
[1] - These characteristics were measured on a single CPU, and they can vary slightly for other processors with the same model number

类别:CPU	制造商:AMD
家族:Phenom II Triple-Core Mobile	产品:AMD Phenom II Triple-Core Mobile N830 - HMN830DCR32GM