一般信息 | |
类型 | |
细分市场 | Mobile |
系列 |
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型号 | |
CPU 编号 |
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Stepping code | |
频率 | 1700 MHz |
总线速度 | One 1800 MHz 16-bit HyperTransport link (3.6 GT/s) |
时钟倍频器 | 8.5 |
封装 | 638-pin lidless organic micro Pin Grid Array (UOL638) |
AMD 封装 number | 30605 |
接口 | |
尺寸 | 1.38" x 1.38" / 3.5cm x 3.5cm |
Weight | 0.2oz / 5.7g (measured) 0.2oz / 6.5g (by specifications) |
发布时间 | |
End-of-Life date | Last order date is end of 3rd quarter 2011 Last shipment date is end of 1st quarter 2012 |
架构 / 微体系结构 | |
微体系结构 | K10 |
Platform | Danube |
处理器内核 | |
Core stepping | BL-C3 |
CPUID | 100F53 |
制造工艺 | 0.045 micron silicon-on-insulator (SOI) technology |
数据位宽 | 64 bit |
CPU核心数 | 4 |
线程数 | 4 |
浮点单元 | Integrated, 128-bit wide |
1级缓存大小 | 4 x 64 KB 2-way set associative instruction caches 4 x 64 KB 2-way set associative data caches |
2级缓存大小 | 4 x 512 KB 16-way set associative caches |
Level 3 cache size | None |
多重处理 | Uniprocessor |
特征 |
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低功耗特性 | PowerNow! |
集成外设/组件 | |
集成显卡 | None |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1066, DDR3L-1066 Maximum memory bandwidth (GB/s): 17.1 |
Other peripherals | HyperTransport technology 3.0 |
电/热参数 | |
热设计功耗 | 25 Watt |