类型 | CPU / Microprocessor |
细分市场 | Mobile |
系列 | AMD Turion Neo X2 |
型号 | L625 |
CPU 编号 |
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频率 | 1600 MHz |
总线速度 | One 800 MHz 16-bit HyperTransport link (1.6 GT/s) |
时钟倍频器 | 8 |
封装 | 812-ball lidless BGA |
接口 | BGA812 |
发布时间 | Aug 10, 2009 |
End-of-Life date | Last order date is end of 4th quarter 2010 Last shipment date is end of 2nd quarter 2011 |
架构 / 微体系结构 | |
Platform | 2nd Gen Ultrathin |
处理器内核 | Conesus |
Core stepping | BH-G2 |
CPUID | 60FB2 |
制造工艺 | 0.065 micron silicon-on-insulator (SOI) technology |
数据位宽 | 64 bit |
The number of cores | 2 |
线程数 | 2 |
浮点单元 | Integrated |
1级缓存大小 | 2 x 64 KB 2-way set associative instruction caches 2 x 64 KB 2-way set associative data caches |
2级缓存大小 | 2 x 512 KB 16-way set associative caches |
Virtual memory | 256 TB |
多重处理 | Uniprocessor |
特征 |
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低功耗特性 | PowerNow! Technology |
集成外设/组件 | |
集成显卡 | None |
Memory controller | The number of controllers: 1 Memory channels: 2 Channel width (bits): 64 Supported memory: DDR2-667 Maximum memory bandwidth (GB/s): 10.7 |
Other peripherals | HyperTransport technology 3.0 |
电/热参数 | |
Maximum operating temperature | 95°C |
热设计功耗 | 18 Watt |
Notes on AMD Turion Neo X2 L625 | |
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