| 类型 | CPU / Microprocessor |
| 细分市场 | Mobile |
| 系列 | AMD Athlon Neo X2 for Ultrathin Notebooks |
| 型号 | L32* |
| CPU 编号 |
|
| 频率 | 1*00 MHz |
| 总线速度 | One 800 MHz 1*-bit HyperTransport link (1.* GT/s) |
| 时钟倍频器 | *.* |
| 封装 | 812-ball lidless BGA |
| 接口 | BGA812 |
| 发布时间 | Aug 10, 200* |
| End-of-Life date | Last order date is end of 4th quarter 2010 Last shipment date is end of 2nd quarter 2011 |
| 架构 / 微体系结构 | |
| Platform | 2nd Gen Ultrathin |
| 处理器内核 | Conesus |
| Core stepping | BH-G2 |
| CPUID | *0FB2 |
| 制造工艺 | 0.0** micron silicon-on-insulator (SOI) technology |
| 数据位宽 | *4 bit |
| The number of cores | 2 |
| 线程数 | 2 |
| 浮点单元 | Integrated |
| 1级缓存大小 | 2 x *4 KB 2-way set associative instruction caches 2 x *4 KB 2-way set associative data caches |
| 2级缓存大小 | 2 x *12 KB 1*-way set associative caches |
| Virtual memory | 2** TB |
| 多重处理 | Uniprocessor |
| 特征 |
|
| 低功耗特性 | PowerNow! |
| 集成外设/组件 | |
| 集成显卡 | None |
| Memory controller | The number of controllers: 1 Memory channels: 2 Channel width (bits): *4 Supported memory: DDR2-*** Maximum memory bandwidth (GB/s): 10.* |
| Other peripherals | HyperTransport technology 3.0 |
| 电/热参数 | |
| Maximum operating temperature | **°C |
| 热设计功耗 | 18 Watt |
