类型 | CPU / Microprocessor | |||||||||
细分市场 | Mobile | |||||||||
系列 | Intel Core i3 Mobile | |||||||||
型号 | i3-370M | |||||||||
CPU 编号 |
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频率 | 2400 MHz | |||||||||
Low power frequency | 933 MHz | |||||||||
总线速度 | 2.5 GT/s DMI | |||||||||
时钟倍频器 | 18 | |||||||||
封装 | 988-pin micro-FCPGA10 (rPGA988A) | |||||||||
接口 | 接口 G1 / rPGA988A | |||||||||
尺寸 | 1.48" x 1.48" / 3.75cm x 3.75cm | |||||||||
Weight | 0.3oz / 7.7g | |||||||||
发布时间 | June 20, 2010 | |||||||||
End-of-Life date | Last order date is October 16, 2012 Last shipment date is April 16, 2013 | |||||||||
S规格号 | ||||||||||
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架构 / 微体系结构 | ||||||||||
微体系结构 | Westmere | |||||||||
Platform | Calpella | |||||||||
处理器内核 | Arrandale | |||||||||
Core stepping | K0 (Q4CH, SLBUK) | |||||||||
CPUID | 20655 (Q4CH, SLBUK) | |||||||||
制造工艺 | 0.032 micron 382 million transistors (CPU die) 177 million transistors (IMC / graphics die) | |||||||||
模具尺寸 | 81mm2 (CPU die) 114mm2 (IMC / graphics die) | |||||||||
数据位宽 | 64 bit | |||||||||
The number of cores | 2 | |||||||||
线程数 | 4 | |||||||||
浮点单元 | Integrated | |||||||||
1级缓存大小 | 2 x 32 KB 4-way set associative instruction caches 2 x 32 KB 8-way set associative data caches | |||||||||
2级缓存大小 | 2 x 256 KB 8-way set associative caches | |||||||||
Level 3 cache size | 3 MB 12-way set associative shared cache | |||||||||
缓存延迟 | 4 (L1 cache) 11 (L2 cache) 38 (L3 cache) | |||||||||
Physical memory | 8 GB | |||||||||
多重处理 | Not supported | |||||||||
特征 |
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低功耗特性 | Enhanced SpeedStep technology | |||||||||
集成外设/组件 | ||||||||||
集成显卡 | GPU 类型: HD (Westmere) Base frequency (MHz): 500 Maximum frequency (MHz): 667 The number of supported displays: 2 | |||||||||
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-800, DDR3-1066 Maximum memory bandwidth (GB/s): 17.1 | |||||||||
Other peripherals |
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电/热参数 | ||||||||||
最小/最大工作温度 | 0°C - 90°C | |||||||||
热设计功耗 | 35 Watt | |||||||||
Notes on Intel Core i3-370M | ||||||||||
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