AMD Turion II Dual-Core Mobile N570 - TMN570DCR23GM笔记本cpu

类型	CPU / Microprocessor
细分市场	Mobile
系列	AMD Turion II Dual-Core Mobile
型号	N570
CPU 编号	TMN570DCR23GM is an OEM/tray microprocessor
Stepping code	AAEKC AE
频率	2700 MHz
总线速度	One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
时钟倍频器	13.5
封装	638-pin lidless organic micro Pin Grid Array (UOL638)
AMD 封装 number	30600
接口	接口 S1 (S1g4)
尺寸	1.38" x 1.38" / 3.5cm x 3.5cm
Weight	0.2oz / 5.6g (measured) 0.2oz / 6.5g (by specifications)
发布时间	Jan 4, 2011
End-of-Life date	Last order date is end of 2nd quarter 2011 Last shipment date is end of 4th quarter 2011
架构 / 微体系结构
微体系结构	K10
Platform	Danube
处理器内核	Champlain
Core stepping	DA-C3
CPUID	100F63
制造工艺	0.045 micron silicon-on-insulator (SOI) technology
数据位宽	64 bit
The number of cores	2
线程数	2
浮点单元	Integrated, 128-bit wide
1级缓存大小	2 x 64 KB 2-way set associative instruction caches 2 x 64 KB 2-way set associative data caches
2级缓存大小	2 x 1 MB 16-way set associative caches
Level 3 cache size	None
多重处理	Uniprocessor
特征	MMX instructions Extensions to MMX 3DNow! technology Extensions to 3DNow! SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSE4a AMD64 / AMD 64-bit technology EVP / Enhanced Virus Protection AMD-V / AMD Virtualization technology
低功耗特性	PowerNow!
集成外设/组件
集成显卡	None
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1066, DDR3L-1066 Maximum memory bandwidth (GB/s): 17.1
Other peripherals	HyperTransport technology 3.0
电/热参数
热设计功耗	35 Watt

类别:CPU	制造商:AMD
家族:Turion II Dual-Core Mobile	产品:AMD Turion II Dual-Core Mobile N570 - TMN570DCR23GM